- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
Patent holdings for IPC class H01L 21/302
Total number of patents in this class: 3400
10-year publication summary
|
299
|
228
|
178
|
111
|
89
|
84
|
54
|
56
|
50
|
16
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokyo Electron Limited | 11599 |
303 |
| Applied Materials, Inc. | 16587 |
237 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
178 |
| Lam Research Corporation | 4775 |
159 |
| Micron Technology, Inc. | 24960 |
141 |
| Samsung Electronics Co., Ltd. | 131630 |
124 |
| United Microelectronics Corp. | 3921 |
72 |
| Texas Instruments Incorporated | 19376 |
55 |
| Kioxia Corporation | 9847 |
52 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
45 |
| Semiconductor Components Industries, L.L.C. | 5345 |
34 |
| Central Glass Company, Limited | 1244 |
34 |
| International Business Machines Corporation | 60644 |
33 |
| CMC Materials LLC | 254 |
33 |
| Sumitomo Electric Industries, Ltd. | 14131 |
31 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
31 |
| Infineon Technologies AG | 8189 |
30 |
| Hitachi High-Tech Corporation | 4424 |
29 |
| Novellus Systems, Inc. | 559 |
28 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
26 |
| Other owners | 1725 |